EP3SL200H780I4

Designed for next-generation automotive electronics, Intel's EP3SL200H780I4 sets new standards in Embedded - FPGAs (Field Programmable Gate Array) for reliability and performance. This radiation-hardened FPGA meets stringent automotive qualification requirements while delivering the computational power needed for autonomous driving subsystems. The architecture incorporates triple-redundant voting logic and SEU-resistant memory for functional safety applications.The 8000 logic array blocks are arranged in fault-tolerant triplets for safety-critical applications. Each CLB includes mismatch detection circuits that flag potential soft errors before they affect system operation.The 200000 logic cell matrix provides ample resources for implementing ASIL-D compliant safety mechanisms. The symmetrical cell distribution ensures balanced routing delays critical for fault detection circuits.With 10901504 bits of protected memory, the device can buffer multiple sensor data streams simultaneously. The ECC-protected memory architecture detects and corrects transient errors caused by automotive electrical noise environments.The 488 automotive-grade I/Os support 12V fault tolerance and include built-in current limiting. Each I/O bank can be independently configured for LIN/CAN FD/FlexRay interface protocols common in vehicle networks.Operating from 0.86V ~ 1.15V, the power architecture includes load-dump protection and reverse polarity safeguards. The adaptive body biasing technique reduces leakage current during extended vehicle standby periods.The Surface Mount package meets automotive vibration specifications while maintaining reliable connections under thermal cycling. The solder joint design has been optimized for lead-free assembly processes required in modern vehicle electronics.Qualified for -40°C ~ 100°C (TJ) operation, the device maintains timing margins across the full automotive temperature range. The thermal shutdown circuitry prevents damage during extended exposure to under-hood conditions.The 780-BBGA, FCBGA package incorporates copper heat spreaders for efficient thermal management in confined automotive modules. The mold compound has been formulated for resistance to automotive fluids and cleaning agents.Supplied in 780-HBGA (33x33) configuration, the device includes automotive-grade moisture sensitivity labeling. The tape-and-reel packaging complies with automated assembly requirements for high-volume vehicle production.