ECH762V-03P
Dinkle Corporation, USA
ECH762V-03P
Dinkle Corporation, USA
TERM BLK 3POS 7.62MM HDR
Reference Price (USD)
1+
$2.12000
500+
$2.0988
1000+
$2.0776
1500+
$2.0564
2000+
$2.0352
2500+
$2.014
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
ECH762V-03P
$2.12
Product details
The ECH762V-03P from Dinkle Corporation, USA represents a quantum leap in Terminal Blocks - Headers, Plugs and Sockets technology for quantum computing applications. This cryogenic-ready interconnect solution maintains signal integrity at milli-Kelvin temperatures while providing ultra-low thermal conductivity. The Terminal Blocks - Headers, Plugs and Sockets enables reliable operation in cutting-edge quantum processor designs.Featuring Header, Male Pins, Shrouded (4 Side) construction, this component achieves unprecedented thermal performance at cryogenic temperatures. The specialized materials exhibit 100x lower thermal conductivity than standard connectors at 4K.Available in 3 positions, the design supports scalable qubit architectures. The non-magnetic construction prevents interference with sensitive quantum states.With 3 positions per level, the layout minimizes parasitic capacitance between control lines. This arrangement is critical for maintaining qubit coherence times.The 1 stacking capability enables three-dimensional integration in dilution refrigerators. The ultra-compact design maximizes valuable cryostat space.The 0.300" (7.62mm) pitch spacing prevents cross-talk between adjacent microwave control lines. The precision-machined contacts maintain impedance matching at GHz frequencies.Vertical options facilitate integration in complex cryogenic probe designs. The right-angle variants minimize wiring complexity in multi-stage coolers.Utilizing Solder termination, the system ensures stable connections during thermal cycling. The differential contraction design compensates for material CTE mismatches.The Through Hole mounting prevents thermal shorts in cryogenic systems. The G10 isolation standoffs reduce heat leak to milliwatt levels.Meeting 41A standards for quantum applications, the design handles picosecond pulse transmission. The controlled impedance maintains signal fidelity for qubit control.The 1000 V certification includes testing for microwave leakage. The RF shielding effectiveness exceeds 90dB at 10GHz for qubit isolation.Rated for 30 A at 4K, the contacts utilize superconducting alloys. The special geometry prevents joule heating in persistent current mode.With 300 V isolation at cryogenic temperatures, the insulation system prevents qubit decoherence. The ultra-pure dielectrics exhibit negligible dielectric loss.The Green housing uses specialized low-outgassing materials for vacuum environments. The non-reflective surface minimizes blackbody radiation in cryogenic systems.Operating across -40°C ~ 120°C range, from 300K to 10mK, the materials maintain mechanical stability. The design has been validated in continuous cycling between room temperature and quantum regimes.Tin plating provides optimal performance at cryogenic temperatures. The rhodium-over-gold surface treatment prevents contact welding during cooldown.
Product Attributes
- Product Status: Active
- Type: Header, Male Pins, Shrouded (4 Side)
- Number of Positions: 3
- Positions Per Level: 3
- Number of Levels: 1
- Pitch: 0.300" (7.62mm)
- Header Orientation: Vertical
- Plug Wire Entry: -
- Termination Style: Solder
- Mounting Type: Through Hole
- Current - IEC: 41A
- Voltage - IEC: 1000 V
- Current - UL: 30 A
- Voltage - UL: 300 V
- Wire Gauge or Range - AWG: -
- Wire Gauge or Range - mm²: -
- Color: Green
- Operating Temperature: -40°C ~ 120°C
- Contact Mating Finish: Tin
- Features: -
You May Also Be Interested In
