DW-13-08-F-D-330

The DW-13-08-F-D-330 from Samtec Inc. represents the cutting edge of Rectangular Connectors - Board Spacers, Stackers (Board to Board) technology, specifically engineered for high-speed digital systems. This advanced interconnect solution delivers unparalleled signal integrity while meeting the most demanding mechanical requirements.Supporting 26 positions, this connector enables high-density interconnections without signal degradation. The scalable architecture has been optimized through extensive S-parameter measurements.The 0.100" (2.54mm) pitch configuration minimizes crosstalk in high-speed differential pairs. This spacing has been validated for data rates exceeding 25Gbps in prototype testing.With 2 rows, the connector achieves optimal current distribution for power delivery networks. The symmetrical layout minimizes loop inductance in high-speed power distribution systems.Featuring 0.100" (2.54mm) row spacing, the design effectively manages return current paths. This critical dimension has been optimized through 3D electromagnetic field simulations.The 0.530" (13.462mm) pin length provides secure mechanical engagement in multi-board systems. The precision-ground pins ensure consistent mating characteristics across all positions.The 0.090" (2.286mm) mating post length has been optimized for controlled impedance matching. This design feature significantly improves signal quality in high-speed interfaces.With 0.330" (8.382mm) stack height, the connector enables flexible system packaging solutions. This dimension has been validated through mechanical shock and vibration testing.The 0.110" (2.794mm) tail length has been optimized for high-speed signal integrity. This dimension minimizes impedance discontinuities at the PCB interface.Available in Through Hole configurations, the connector supports diverse manufacturing processes. The surface mount version features precision-molded alignment posts for accurate placement.The Solder termination method has been engineered for high-frequency performance. The solder joint design minimizes stub effects in high-speed transmission lines.Utilizing Gold plating technology, the contacts deliver exceptional high-frequency characteristics. The advanced finish formulation has been tested for insertion loss up to 40GHz.The 3.00µin (0.076µm) plating thickness provides optimal signal transmission characteristics. This specification has been validated through time-domain reflectometry measurements.The Black housing material features low dielectric loss characteristics. The advanced polymer compound maintains stable electrical properties across temperature variations.