DW-04-08-S-D-300

Optimized for high-density applications, the DW-04-08-S-D-300 by Samtec Inc. redefines performance standards in Rectangular Connectors - Board Spacers, Stackers (Board to Board). This innovative connector solution integrates advanced materials science with precision manufacturing to deliver exceptional electrical and mechanical characteristics.Supporting 8 positions, this connector enables complex system architectures without compromising signal quality. The position count has been optimized through rigorous signal integrity analysis.The 0.100" (2.54mm) pitch design reduces parallel plate capacitance while maintaining mechanical robustness. This spacing is ideal for impedance-controlled transmission lines in high-frequency circuits.The 2-row configuration provides balanced current distribution for power applications. The symmetrical layout minimizes voltage drop across the connector interface.With 0.100" (2.54mm) row spacing, the connector effectively manages crosstalk in mixed-signal environments. This critical dimension has been validated through TDR measurements up to 10GHz.The 0.530" (13.462mm) pin length accommodates various PCB thicknesses while maintaining proper mechanical retention. The precision-ground pins ensure consistent mating characteristics.Featuring 0.120" (3.048mm) mating post length, the connector achieves optimal contact wipe during engagement. This design feature significantly improves contact reliability in dynamic applications.The 0.300" (7.620mm) stack height enables flexible system packaging options. This dimension has been optimized through finite element analysis to ensure mechanical stability.The 0.110" (2.794mm) tail length facilitates reliable solder joint formation in automated assembly. This dimension has been optimized for both solder paste and wave soldering processes.Available in Through Hole configurations, the connector supports diverse manufacturing workflows. The surface mount version features coplanarity controls for reliable reflow soldering.The Solder termination method has been engineered for high-yield manufacturing. The solder tail design incorporates stress-relief features for improved thermal cycling performance.Utilizing Gold plating technology, the contacts deliver exceptional durability. The advanced finish formulation has been tested to withstand 1000+ mating cycles.The 30.0µin (0.76µm) plating thickness provides optimal balance between cost and performance. This specification meets MIL-STD-202H requirements for harsh environments.The Black housing material exceeds UL94 V-0 flammability ratings. The high-temperature resistant polymer maintains mechanical properties across the full operating range.