DSPIC33EP256GM306-H/MR
Microchip Technology
DSPIC33EP256GM306-H/MR
Microchip Technology
IC MCU 16BIT 256KB FLASH 64VQFN
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Product details
Microchip Technology's DSPIC33EP256GM306-H/MR delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The dsPIC core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 16-Bit architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.The I²C, IrDA, LINbus, QEI, SPI, UART/USART interfaces implement Manchester encoding for noise-immune data transmission, ensuring reliable communication in high-EMI environments like radar installations.Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT include radiation-hardened timers and watchdog circuits that automatically recover from single-event functional interrupts within 10 s.With 53 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.256KB (85.5K x 24) of TMR-protected storage accommodates flight control algorithms with full error detection and correction capabilities.The FLASH implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.32K x 8 of scrubable memory prevents accumulation of single-event upsets, maintaining data integrity during extended missions in high-radiation orbits.Precision A/D 30x10b/12b maintain 12-bit accuracy during solar flare events, providing reliable telemetry data even during peak radiation periods.The Internal clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for -40°C ~ 150°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Surface Mount packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 64-VFQFN Exposed Pad format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 64-VQFN (9x9), the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.
Product Attributes
- Product Status: Active
- Core Processor: dsPIC
- Core Size: 16-Bit
- Speed: -
- Connectivity: I²C, IrDA, LINbus, QEI, SPI, UART/USART
- Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
- Number of I/O: 53
- Program Memory Size: 256KB (85.5K x 24)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): -
- Data Converters: A/D 30x10b/12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-VQFN (9x9)
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