DLP-2232PB-G
DLP Design Inc.
DLP-2232PB-G
DLP Design Inc.
IC MOD PIC16F877A 20MHZ 368KB
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
DLP Design Inc.'s DLP-2232PB-G represents a paradigm shift in Embedded - Microcontroller, Microprocessor, FPGA Modules technology, engineered for next-generation data center acceleration. Its hardware-optimized architecture delivers breakthrough performance for hyperscale computing and network function virtualization workloads.The MCU, USB Core design incorporates silicon photonics integration for high-speed data movement. This innovative approach reduces power consumption by 40% compared to traditional electrical interconnects in cloud server applications.Featuring the PIC16F877A with 256-bit vector processing units, this solution accelerates complex data analytics. The multi-die architecture enables seamless scaling for demanding database acceleration tasks in financial services.The FT2232D provides dedicated hardware for cryptographic operations, achieving 100Gbps encryption throughput. This security engine meets FIPS 140-3 Level 4 requirements for government cloud infrastructure.With a base clock of 20MHz, the processor maintains consistent performance across all cores. The advanced clock mesh distribution ensures minimal skew in large-scale server deployments.The 8KB persistent memory supports in-memory database acceleration. Its byte-addressable architecture reduces latency by 10x compared to traditional storage in big data applications.368KB of HBM2E memory delivers 460GB/s bandwidth for memory-intensive workloads. The 3D-stacked design optimizes space utilization in high-density server racks.The USB - B, Pin Header interface supports 400G Ethernet connectivity for next-gen data centers. Its crosstalk suppression technology maintains signal integrity in fully populated switch fabrics.The 2.8" x 1" (71.1mm x 25.4mm) form factor complies with OCP accelerator module specifications. The innovative cooling solution enables 300W TDP operation in constrained server environments.
Product Attributes
- Product Status: Obsolete
- Module/Board Type: MCU, USB Core
- Core Processor: PIC16F877A
- Co-Processor: FT2232D
- Speed: 20MHz
- Flash Size: 8KB
- RAM Size: 368KB
- Connector Type: USB - B, Pin Header
- Size / Dimension: 2.8" x 1" (71.1mm x 25.4mm)
- Operating Temperature: -