DL-060-24-00-00-00
Laird Thermal Systems, Inc.
Product details
Designed for industrial IoT edge computing, Laird Thermal Systems, Inc.'s DL-060-24-00-00-00 advances Thermal - Thermoelectric, Peltier Assemblies technology with AI-optimized thermal management. This intelligent Peltier system dynamically adjusts cooling parameters to maintain optimal processor performance while conserving energy in distributed computing nodes.Implementing Direct to Liquid strategy, the solution achieves 30% better heat flux density than conventional designs for high-TDP AI accelerators.Delivering 60 W of adaptive cooling power, the module supports variable workloads in predictive maintenance gateways.The 2.7 A operational profile has been tuned for harmonic compatibility with PoE+ power delivery systems in smart factories.Supporting 24 V industrial power standards, the design incorporates transient voltage suppression for harsh electrical environments.Rated for -10°C ~ 63°C, the assembly reliably operates in uncontrolled environments from foundry floors to oil rigs.Weighing 0.882 lb (400.07 g), the robust construction withstands mechanical shocks common in mobile industrial equipment.The 100mm L x 60mm W x 39mm H dimensions comply with DIN rail mounting specifications for easy integration into control cabinets.
Product Attributes
- Product Status: Active
- Heat Transfer Type: Direct to Liquid
- Power - Cooling: 60 W
- Current: 2.7 A
- Voltage: 24 V
- Fan Location: -
- Power - Input: -
- Operating Temperature: -10°C ~ 63°C
- Weight: 0.882 lb (400.07 g)
- Dimensions - Overall: 100mm L x 60mm W x 39mm H