DCCDB09F

Switchcraft Inc.

General info

Part Number

DCCDB09F

Manufacturer

Switchcraft Inc.

Description:

CONN D-SUB RCPT 9POS SLDR CUP

Reference Price (USD)

$20.21240

500+

$20.010276

1000+

$19.808152

1500+

$19.606028

2000+

$19.403904

2500+

$19.20178

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

DCCDB09F

$20.21

Product details

Designed for aerospace avionics, Switchcraft Inc.'s DCCDB09F D-Sub Connectors meets DO-160G standards while reducing weight by 40% versus traditional connectors. The composite shell design maintains shielding effectiveness during 50,000-foot altitude cycling.The D-Sub configuration incorporates anti-vibration features that maintain contact integrity during 20G shock events.Receptacle, Female Sockets contacts employ quad-redundant springs that maintain continuity during 15G vibration per MIL-STD-810.The 9 layout includes arc-resistant spacing that prevents flashover at 35,000-foot equivalent altitudes.Precision-machined 2 contact arrays maintain alignment within 0.1mm during thermal cycling from -65 C to +125 C.Free Hanging (In-Line) variant features hermetic glass seals that maintain <1x10-9 atm-cc/sec helium leak rate.The 1 (DE, E) design provides 100dB shielding effectiveness from 10kHz to 18GHz per MIL-STD-461G.Signal implementation uses beryllium-nickel alloys that maintain spring properties at cryogenic temperatures.The Cable Side, Male Jackscrew system incorporates vibration-resistant hardware that meets NASM25027 torque retention requirements.Our Solder Cup methodology creates joints that survive 1000 thermal cycles from -65 C to +200 C.Steel, Tin Plated demonstrates >500-hour salt spray resistance per ASTM B117 with no measurable corrosion.The Gold surface treatment maintains <5m resistance after 500 hours of mixed flowing gas testing.IP67 - Dust Tight, Waterproof validation includes 100 thermal shock cycles from -65 C to +125 C with no seal degradation.All materials exceed UL94 V-0 requirements while maintaining low outgassing (<1% TML, <0.1% CVCM).The 5A design incorporates parallel current paths that reduce thermal resistance by 30%.