D09P33E6GX00LF

Amphenol ICC (FCI)

General info

Part Number

D09P33E6GX00LF

Manufacturer

Amphenol ICC (FCI)

Description:

CONN D-SUB PLUG 9POS R/A SLDR

Datasheet:

D09P33E6GX00LF PDF

Reference Price (USD)

$2.08000

500+

$2.0592

1000+

$2.0384

1500+

$2.0176

2000+

$1.9968

2500+

$1.976

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

D09P33E6GX00LF

$2.08

Product details

The D09P33E6GX00LF by Amphenol ICC (FCI) revolutionizes D-Sub Connectors performance in high-speed data center applications. Designed for 112G PAM4 signaling, this connector achieves <0.5dB insertion loss at 28GHz while maintaining 100 differential impedance within 5% tolerance.Featuring D-Sub architecture, the compact design enables 40% higher port density than traditional form factors without compromising thermal management capabilities.The Plug, Male Pins configuration implements edge-coupled differential pairs with controlled skew (<5ps) for precise timing alignment in SerDes applications.9 layout incorporates ground-stitching vias that reduce simultaneous switching noise by 22dB in 56Gbps NRZ applications.Precision-molded 2 dielectric body maintains <3% impedance variation across all channels for consistent signal integrity performance.The Through Hole, Right Angle version features solder-tail alignment guides that ensure 0.1mm placement accuracy during reflow processes.Optimized for airflow management, 1 (DE, E) design reduces pressure drop by 30% compared to conventional cage designs.Signal implementation uses phosphor bronze alloys with selective gold plating for optimal signal integrity and durability.The Housing/Shell (4-40) system incorporates thermal interface pads that improve heat dissipation by 25% in high-power applications.Our Solder process creates solder joints that withstand 1000 thermal cycles from 0 C to +100 C without degradation.Steel, Tin-Nickel Plated construction provides 60dB EMI shielding effectiveness up to 40GHz for sensitive RF applications.The Gold or Gold, GXT™ surface treatment maintains <15m contact resistance after 10,000 mating cycles in dusty environments.Precision-controlled 30.0µin (0.76µm) ensures proper skin depth for high-frequency signal transmission up to 50GHz.All materials exceed UL94 V-0 requirements while maintaining low smoke generation (<15% opacity).The 5A per Contact design incorporates current-sharing topology that reduces joule heating by 40% at full load.0.318" (8.08mm) dimensional control ensures proper clearance for heat sink installation in 1U rack configurations.Board Lock, Grounding Indents, Mounting Brackets include integrated retimer circuitry that compensates for up to 36dB channel loss at 56Gbps.