CYUSB3013-BZXC

The CYUSB3013-BZXC from Infineon Technologies establishes a new paradigm in Embedded - Microcontrollers - Application Specific, crafted for aerospace and defense systems. This radiation-hardened microcontroller delivers fault-tolerant computing with SEU (Single Event Upset) mitigation techniques, ensuring reliable operation in space environments.Designed for SuperSpeed USB Peripheral Controller deployments, the device incorporates triple-modular redundancy for critical processing paths. Its MIL-STD-883 qualified design withstands total ionizing dose effects up to 300krad(Si).Powered by ARM9® architecture, the CPU implements error-correcting register files and parity-protected caches. The dual-core design achieves 99.999% fault coverage through lockstep operation.With External Program Memory configuration, the memory subsystem employs scrubbing algorithms for SEU recovery. The EDAC-protected flash maintains data integrity even under heavy particle bombardment.As part of the CYUSB family, this device shares radiation mitigation strategies with flight-proven designs. The common architecture reduces qualification effort for new missions.The 512K x 8 memory implements SECDED (Single Error Correction, Double Error Detection) across all banks. Refresh cycles are managed by radiation-hardened controllers.The GPIF, I²C, I²S, SPI, UART, USB suite includes SpaceWire links with 200Mbps throughput. Each communication channel features transformer isolation meeting ESA ECSS standards.Providing 60 radiation-hardened ports, the GPIO matrix supports LVDS signaling. Each I/O cell includes single-event transient filters for glitch suppression.Operating across 1.15V ~ 1.25V ranges, the power system implements single-event burnout protection. The distributed voltage regulators maintain operation during solar flare events.Rated for 0°C ~ 70°C extremes, the package utilizes ceramic substrates with gold metallization. Thermal vias maintain junction temperatures in vacuum conditions.The Surface Mount configuration supports hermetic sealing processes. Die attachment uses AuSi eutectic bonding for mechanical stability under vibration.Available in 121-TFBGA format, the package features Kovar leads for CTE matching. Internal getters maintain low moisture levels throughout mission life.Delivered in 121-FBGA (10x10), each unit undergoes proton irradiation testing. Lot traceability documentation includes radiation test certificates.