CYUSB3011-BZXC

Infineon Technologies introduces CYUSB3011-BZXC, a breakthrough in Embedded - Microcontrollers - Application Specific for high-speed data acquisition systems. This application-specific microcontroller combines 16-bit ADCs with jitter-cleaning PLLs, enabling precision measurement in test and measurement equipment.Engineered for SuperSpeed USB Peripheral Controller implementations, the device includes hardware-accelerated windowed FFT processing. The analog front-end achieves 90dB SFDR at 10MSPS sampling rates.The ARM9® architecture features SIMD operations for vectorized signal processing. The deterministic interrupt latency ensures precise timing of acquisition triggers.With External Program Memory flexibility, the memory subsystem supports real-time waveform storage. The dual-bank architecture enables continuous streaming without throughput gaps.As a member of the CYUSB family, this device shares calibration algorithms with related products. The consistent measurement API simplifies instrument design.The 256K x 8 memory implements ECC protection for measurement integrity. The multi-port architecture allows simultaneous access from acquisition and processing units.The GPIF, I²C, I²S, SPI, UART, USB connectivity includes JESD204B serial links with 12.5Gbps lanes. Each transceiver implements adaptive equalization for long-reach backplane connections.Providing 60 configurable ports, the device supports direct sensor excitation. Each analog output includes 20-bit calibration coefficients in OTP memory.Operating from 1.15V ~ 1.25V sources, the power architecture achieves 100dB PSRR. The integrated voltage references maintain 1ppm/ C stability for precision measurements.Rated for 0°C ~ 70°C operation, the package uses low-thermal EMF materials. The symmetrical design minimizes thermocouple effects in sensitive circuits.The Surface Mount configuration supports impedance-controlled PCB layouts. The package footprint includes guard ring connections for sensitive analog sections.Available in 121-TFBGA format, the package features gold-plated pads for contact reliability. The low-ESL design maintains signal integrity up to 3GHz bandwidth.Supplied in 121-FBGA (10x10) configuration, each unit includes individual calibration reports. Production testing includes full characterization across temperature.