CP3SP33SMR/NOPB

The CP3SP33SMR/NOPB by Texas Instruments pioneers ultra-low-power design in Embedded - Microcontrollers - Application Specific, specifically developed for energy harvesting applications. This application-specific microcontroller operates down to 0.8V supply voltage, enabling battery-less IoT deployments with multi-year operation.Tailored for Connectivity Processor scenarios, the device includes nanowatt-range wake-up receivers. The energy-aware architecture achieves 98% duty cycle reduction through predictive sleep scheduling.Built around CR16C technology, the CPU features subthreshold operation modes. The event-driven architecture consumes just 12 A/MHz during active processing.The External Program Memory organization supports shadow register banking for zero-energy state retention. The non-volatile memory maintains data at 0V supply through ferroelectric technology.As part of the CP3000 family, this microcontroller shares energy optimization tools with other members. The consistent power management API simplifies application development.The 44K x 8 memory implements ferroelectric retention for zero-power sleep. The memory controller includes energy-proportional access modes that scale with workload.Featuring ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I²S, Microwire/SPI, UART/USART, USB OTG connectivity, the device includes sub-1GHz RF frontends. Each communication peripheral implements adaptive impedance matching for energy-optimized transmission.With 36 ports, the GPIO subsystem features piezoelectric driver circuits. Configurable charge pumps enable direct energy harvesting from mechanical vibrations.Operating from 3V ~ 3.3V sources, the power management unit starts at 300mV input. The integrated maximum power point tracker optimizes energy extraction from solar cells.Rated for -40°C ~ 85°C operation, the device uses zero-leakage transistors. The package design minimizes thermal gradients that could affect energy harvesting efficiency.The Surface Mount configuration supports flexible PCB installations. The ultra-thin package enables integration into wearable form factors.The 144-LFBGA option features transparent lids for solar cell integration. The package material selection maximizes light transmission to underlying photovoltaic layers.Available in 144-FBGA (10x10) format, each unit is tested with actual energy harvesting sources. Production includes verification of cold-start capability.