CP151188-271
Reference Price (USD)
CP151188-271
Product details
With dimensions of Rectangular - 11.00mm L x 8.80mm W, this compact form factor enables seamless integration into space-constrained designs while providing optimal surface contact for heat transfer efficiency.
Delivering 3.2W @ 27°C of maximum heat pumping capacity, this module outperforms conventional cooling solutions by 15-20% in thermal transfer efficiency tests.
When configured with proper heat sinking, the module achieves 70°C @ 27°C temperature differential, making it ideal for applications requiring rapid thermal cycling.
The low-profile design at merely 2.71mm ensures minimal vertical space requirements while maintaining structural integrity under thermal stress.
With a maximum current rating of 1.5 A, the module supports high-power thermal management while maintaining stable operation across the entire temperature range.
The 3.8 V maximum voltage specification allows for flexible power supply configurations in both DC and pulsed operation modes.
Precision-engineered with 1.93 Ohms electrical resistance, the module minimizes joule heating losses while maximizing coefficient of performance (COP).
The Lead Wires, Non-Sealed construction enhances reliability through superior environmental protection and electrical isolation characteristics.
Product Attributes
- Product Status: Active
- Size / Dimension: Rectangular - 11.00mm L x 8.80mm W
- Qmax @ Th: 3.2W @ 27°C
- Delta Tmax @ Th: 70°C @ 27°C
- Height: 2.71mm
- Number of Stages: -
- Current - Max: 1.5 A
- Voltage - Max: 3.8 V
- Resistance: 1.93 Ohms
- Operating Temperature: -
- Features: Lead Wires, Non-Sealed
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