COH-1706-200-05

Taica North America Corporation

General info

Part Number

COH-1706-200-05

Manufacturer

Taica North America Corporation

Description:

THERMAL INTERFACE PAD, GAP PAD,

Datasheet:

COH-1706-200-05 PDF

Reference Price (USD)

$4.76000

500+

$4.7124

1000+

$4.6648

1500+

$4.6172

2000+

$4.5696

2500+

$4.522

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

COH-1706-200-05

$4.76

Product details

Taica North America Corporation's COH-1706-200-05 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Gel Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Square configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 200.00mm x 200.00mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0200" (0.508mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Silicone Gel formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.Featuring Tacky - Both Sides properties, this solution offers reliable component bonding without outgassing concerns. This characteristic is critical for maintaining clean environments in precision RF assemblies.The Gray coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.Delivering 3.8W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.