CNU113-314-2201-VE

Yamaichi Electronics

General info

Part Number

CNU113-314-2201-VE

Manufacturer

Yamaichi Electronics

Description:

314P, AUTOMOTIVE GRADE MXM3.1 TY

Reference Price (USD)

$20.91000

500+

$20.7009

1000+

$20.4918

1500+

$20.2827

2000+

$20.0736

2500+

$19.8645

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

CNU113-314-2201-VE

$20.91

Product details

Yamaichi Electronics's CNU113-314-2201-VE represents a breakthrough in Card Edge Connectors - Edgeboard Connectors technology for next-generation systems. Optimized for high-speed digital interfaces, this connector combines superior electrical performance with ruggedized construction for demanding applications.Supporting Non Specified - Dual Edge standards, the connector features adaptive contact geometry. This innovative design automatically compensates for card thickness variations up to 0.015" during insertion.The Female configuration incorporates patented contact protection. When unmated, spring-loaded shutters prevent contamination ingress, meeting IP67 requirements when properly panel-mounted.The 314 total contacts support parallel bus architectures. Each contact path is individually tuned to maintain characteristic impedance within 5% of nominal value.The 2 row arrangement incorporates ground contacts between signal pairs. This configuration provides 30 controlled impedance for high-speed differential signals.The 0.020" (0.50mm) pitch design enables 28Gbps NRZ signaling. Precision-molded dielectric spacers maintain consistent propagation velocity across all contact pairs.Dual readout capability supports advanced diagnostic monitoring. Integrated test points allow in-circuit verification without disassembly.The Board Guide package includes EMI gaskets and grounding clips. These options reduce common-mode noise by 18dB in 1-6GHz frequency range.Surface Mount installation features anti-walk pegs. These positive retention features prevent connector movement during vibration per MIL-STD-810G Method 514.7.The Solder method creates metallurgical bonds without thermal degradation. Process controls maintain peak reflow temperatures below 260 C for lead-free assembly compatibility.Copper Alloy contacts exhibit exceptional stress relaxation resistance. After 1,000 hours at 125 C, contact force remains within 90% of initial value.The Gold-Nickel surface treatment provides superior corrosion resistance. Salt spray testing per ASTM B117 shows no degradation after 500 hours exposure.The Black housing material includes halogen-free flame retardants. Compliant with UL94 V-0 requirements, it prevents flame propagation in vertical burn tests.Rated for -40°C ~ 105°C, the connector uses thermally matched materials. Coefficient of thermal expansion (CTE) is controlled within 12ppm/ C to prevent thermal cycling failures.