CFPSL2IWY

The CFPSL2IWY from Panduit Corp delivers breakthrough performance in Keystone - Faceplates, Frames, designed for mission-critical aerospace applications. Its radiation-hardened design ensures reliable operation in satellite communications, featuring exceptional EMI shielding effectiveness that surpasses MIL-STD-461 requirements.The Single Gang configuration incorporates quad-redundant contact systems for fail-safe operation. Compared to commercial-grade connectors, this design provides 60% higher vibration resistance in high-G force environments.As a Faceplate, this component utilizes beryllium copper alloys for consistent spring force across extreme temperature fluctuations. When tested in vacuum conditions, it maintains stable contact resistance beyond 1,000 thermal cycles.With 2 ports, the layout supports modular avionics architectures. The symmetrical arrangement prevents signal degradation in high-speed data buses critical for flight control systems.The Angled/Sloped orientation was validated through computational fluid dynamics modeling. This configuration minimizes particulate accumulation in jet engine nacelle installations.The White, Off finish employs specialized coatings that resist hydraulic fluids and jet fuels. This protective layer maintains legibility under UV exposure at high altitudes.Including Label Cover/Holder with Labels, Mounting Hardware, the design addresses unique aerospace challenges. The integrated hermetic seals maintain cabin pressure integrity while preventing moisture ingress.Certified for use with Mini-Com® Series (Flat, Sloped, Sloped Recessed or Blank), it meets DO-160 standards for airborne equipment. The solution is qualified for both commercial and military aircraft platforms.The 4.500" (114.30mm) dimension reflects optimization for standard LRU (Line Replaceable Unit) enclosures. This precision engineering allows for tool-less maintenance in confined aircraft bays.2.748" (69.80mm) width specification ensures compatibility with ARINC 600 rack systems. The design incorporates heat dissipation fins for passive cooling in avionics compartments.With 1.055" (26.80mm) depth, the profile accommodates backshell accessories without interfering with adjacent systems. This streamlined design is critical for weight-sensitive aerospace applications.Constructed from Acrylonitrile Butadiene Styrene (ABS), the housing demonstrates exceptional strength-to-weight ratio. Material selection meets NASA outgassing requirements for space applications.