C8051T630-GDI
Silicon Labs
C8051T630-GDI
Silicon Labs
IC MCU 8BIT 8KB OTP DIE
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Product details
Silicon Labs's C8051T630-GDI sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The 8051 core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 8-Bit processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 25MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With SMBus (2-Wire/I²C), SPI, UART/USART protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive POR, PWM, Temp Sensor, WDT suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.17 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.8KB (8K x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The OTP implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.768 x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 1.8V ~ 3.6V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.The A/D 16x10b; D/A 1x10b configuration achieves 90dB SNR for precise battery current sensing in hybrid/electric vehicles, enabling state-of-charge accuracy within 1%.Internal clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -40°C ~ 85°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.Die packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.
Product Attributes
- Product Status: Obsolete
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 25MHz
- Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
- Peripherals: POR, PWM, Temp Sensor, WDT
- Number of I/O: 17
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: OTP
- EEPROM Size: -
- RAM Size: 768 x 8
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Data Converters: A/D 16x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: -
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