C8051F330-GDI
Silicon Labs
C8051F330-GDI
Silicon Labs
IC MCU 8BIT 8KB FLASH DIE
Reference Price (USD)
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$5.70000
500+
$5.643
1000+
$5.586
1500+
$5.529
2000+
$5.472
2500+
$5.415
Exquisite packaging
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C8051F330-GDI
$5.70
Product details
Silicon Labs's C8051F330-GDI redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The 8051 architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 8-Bit SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 25MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The SMBus (2-Wire/I²C), SPI, UART/USART interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated POR, PWM, Temp Sensor, WDT include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.17 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.8KB (8K x 8) accommodates quantized neural network models with space remaining for traditional computer vision algorithms.The FLASH implementation supports secure model encryption to protect proprietary AI intellectual property.768 x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 2.7V ~ 3.6V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.High-speed A/D 16x10b; D/A 1x10b sample image sensor analog outputs with 10-bit resolution at 100MSPS, eliminating the need for external ADCs.The Internal generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 85°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Surface Mount packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The Die incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.
Product Attributes
- Product Status: Active
- Core Processor: 8051
- Core Size: 8-Bit
- Speed: 25MHz
- Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
- Peripherals: POR, PWM, Temp Sensor, WDT
- Number of I/O: 17
- Program Memory Size: 8KB (8K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 768 x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
- Data Converters: A/D 16x10b; D/A 1x10b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: -
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