BSTCR-110-D-090-20-GT-210-LF

Designed for reliability in extreme conditions, Major League Electronics's BSTCR-110-D-090-20-GT-210-LF sets new benchmarks in Rectangular Connectors - Board Spacers, Stackers (Board to Board) performance. This ruggedized interconnect solution combines military-grade construction with precision electrical characteristics for mission-critical systems.With 20 available positions, this connector supports complex system architectures. The scalable design maintains signal integrity even in high-density configurations.The 0.100" (2.54mm) pitch configuration minimizes signal skew in high-speed parallel interfaces. This spacing has been optimized through extensive electromagnetic field simulations.The 2-row architecture provides balanced current distribution for power applications. This design feature significantly reduces parasitic inductance in high-current paths.Featuring 0.100" (2.54mm) row spacing, the connector effectively isolates sensitive analog signals. This critical dimension has been validated in mixed-signal prototype testing.With 0.290" (7.366mm) mating post length, the connector achieves optimal contact pressure distribution. This design feature prevents fretting corrosion in vibration-prone environments.The 0.210" (5.334mm) stack height enables flexible system packaging solutions. This dimension has been optimized through thermal-mechanical stress analysis.The 0.090" (2.286mm) tail length has been optimized for high-reliability soldering processes. This dimension ensures proper solder fillet formation in both manual and automated assembly.Available in Through Hole, Right Angle variants, the connector supports diverse manufacturing requirements. The through-hole version features reinforced solder joints for mechanical durability.The Solder termination method has been qualified for high-reliability applications. The solder joint design exceeds IPC-A-610 Class 3 requirements.Employing Gold plating technology, the contacts deliver exceptional corrosion resistance. The advanced finish formulation has been tested in salt spray environments.The 10.0µin (0.25µm) plating thickness provides optimal wear characteristics. This specification has been validated through extensive mating cycle testing.The Black housing material incorporates conductive additives for ESD protection. The compound maintains its mechanical properties across the full military temperature range.