BSP-226769-01
Samtec Inc.
BSP-226769-01
Samtec Inc.
XCEDE HD DAUGHTER CARD ASSEMBLY
Reference Price (USD)
1+
$34.69000
500+
$34.3431
1000+
$33.9962
1500+
$33.6493
2000+
$33.3024
2500+
$32.9555
Exquisite packaging
Discount
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BSP-226769-01
$34.69
Product details
The BSP-226769-01 by Samtec Inc. revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Daughtercard implementations, this series excels in co-packaged optics interconnect applications.Featuring Receptacle, Female Sockets and Blade Sockets configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The XCede® design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.The 0.071" (1.80mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.Through Hole, Right Angle installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.
Product Attributes
- Product Status: Active
- Connector Usage: Daughtercard
- Connector Type: Receptacle, Female Sockets and Blade Sockets
- Connector Style: XCede®
- Number of Positions: -
- Number of Positions Loaded: -
- Pitch: 0.071" (1.80mm)
- Number of Rows: -
- Number of Columns: -
- Mounting Type: Through Hole, Right Angle
- Termination: -
- Contact Layout, Typical: -
- Features: -
- Contact Finish: -
- Contact Finish Thickness: -
- Color: -
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