BSA108N00550236000

TE Intercontec

General info

Part Number

BSA108N00550236000

Manufacturer

TE Intercontec

Description:

CONN PLG HSG FMALE 8POS INLINE

Reference Price (USD)

$25.47000

500+

$25.2153

1000+

$24.9606

1500+

$24.7059

2000+

$24.4512

2500+

$24.1965

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

BSA108N00550236000

$25.47

Product details

The BSA108N00550236000 by TE Intercontec delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Plug Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Female Sockets implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 8 (4 + 3 Power + PE) configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.The Free Hanging (In-Line) installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.Push-Twist mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring Keyed polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.The Zinc Die Cast construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.Nickel surface treatment maintains <0.1 contact resistance at 4K. The coating withstands 1000+ vacuum cycles without degradation.The Silver coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Rated IP66/IP67 - Dust Tight, Water Resistant, Waterproof, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Compliant with UL94 V-0 standards, the materials produce zero toxic outgassing. Critical for cleanroom applications requiring NASA outgassing compliance.Integrated Backshell, Cable Clamp, Coupling Nut include superconducting contacts for zero-resistance signal paths. The niobium-titanium alloy contacts transition below 9.3K critical temperature.Shielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.