BPC300-X

Panduit Corp's BPC300-X represents the next evolution in Terminals - Wire Splice Connectors technology, optimized for 5G infrastructure and telecom applications. This precision-engineered solution addresses the growing demand for high-speed data transmission with minimal insertion loss across its operating range.The Bi-Metal Splice, Single End architecture enables parallel wire management in space-constrained installations. When deployed in base station equipment, its low-profile design reduces cabinet footprint by up to 25% compared to conventional solutions.Configured with 1 access ports, this terminal facilitates rapid field servicing without compromising connection integrity. Network technicians benefit from its tool-less reconfiguration capabilities.Utilizing Crimp technology, the connector maintains stable contact resistance below 5m throughout its service life. This exceeds TIA-968-B requirements for central office equipment.Compatible with 300MCM (kcmil) conductors, the 590DC-CDG supports hybrid fiber-copper networks. Its broad compatibility range simplifies inventory management for telecom operators.The Non-Insulated system incorporates halogen-free materials meeting IEC 60754-1 standards. This makes the connector suitable for plenum-rated installations where smoke emission is a concern.Engineered with Cap, Gel Filled, Insulating Rubber Sleeve, Pigtail, this connector series demonstrates exceptional RF shielding effectiveness. Independent testing verified 90dB attenuation at 6GHz, making it ideal for mmWave applications.Green identification markers comply with ANSI/TIA-606-C labeling standards. The high-contrast coloration improves traceability in dense network racks by 60%.