BOND PLY 660P 11X12"

The BOND PLY 660P 11X12" from Bergquist represents a significant advancement in Thermal - Pads, Sheets for industrial automation systems. This robust thermal solution is specifically designed to meet the demanding requirements of factory automation equipment and industrial control systems.As a high-reliability Sheet, Tape, this product offers exceptional long-term stability under continuous operation. The material maintains its thermal properties even after extended exposure to industrial operating conditions.Precision-engineered in Rectangular formats, this solution enables efficient thermal management of industrial power electronics. The optimized geometries ensure maximum contact area with heat-generating components.Available in 304.80mm x 279.40mm sizes, this material accommodates both large motor drives and compact control modules. The standardized dimensions ensure compatibility with common industrial enclosure designs.The carefully controlled 0.0080" (0.203mm) provides optimal balance between thermal transfer and mechanical compliance. This characteristic is particularly valuable in applications subject to mechanical vibration.Formulated with industrial-grade Polyimide, this pad exhibits exceptional resistance to oils and chemicals. This property ensures reliable performance in harsh manufacturing environments.Featuring Adhesive - Both Sides properties, this solution offers secure component bonding in vibrating environments. The high-tack formulation maintains adhesion integrity throughout the product lifecycle.The rugged Polyimide provides excellent handling characteristics in industrial settings. This feature facilitates quick installation during equipment maintenance and upgrades.The Brown identification system enables quick visual verification during maintenance procedures. This feature simplifies component replacement in complex industrial systems.With an ultra-low 0.81°C/W rating, this material minimizes thermal bottlenecks in critical heat paths. The optimized structure facilitates efficient heat transfer away from sensitive components.Achieving 0.4W/m-K performance, this solution enables more efficient cooling of industrial power electronics. The material's consistent performance helps extend component lifespan in demanding applications.