BGAH325-075E
Ohmite
BGAH325-075E
Ohmite
BGA HEATSINK W/TAPE
Reference Price (USD)
1+
$6.89000
500+
$6.8211
1000+
$6.7522
1500+
$6.6833
2000+
$6.6144
2500+
$6.5455
Exquisite packaging
Discount
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BGAH325-075E
$6.89
Product details
The BGAH325-075E by Ohmite revolutionizes thermal management in the Thermal - Heat Sinks sector, specifically tailored for renewable energy inverters. This advanced solution combines superior heat dissipation with rugged environmental protection, ensuring reliable performance in solar and wind power applications.The Top Mount Extruded design features optimized fin geometry that reduces thermal resistance by 22% compared to standard profiles. When subjected to IEC 60068-2-52 salt spray testing, the corrosion resistance exceeds 1000 hours.Designed for high-power IGBT modules, this solution handles {Power Dissipation @ Temperature Rise} in 85 C ambient conditions. The thermal interface maintains stability across 20,000+ power cycles, critical for solar farm operations.The Spring Clip system provides consistent mounting pressure (15-25N) across all PCB thicknesses (1.0-3.2mm). Field testing demonstrates vibration resistance up to 5g RMS in wind turbine applications.Hexagonal Pin Fin configuration achieves {Thermal Resistance @ Forced Air Flow} in multidirectional airflow environments. Computational analysis shows 15% better turbulence management than traditional square pin designs.The 1.279" (32.50mm) dimension accommodates standard 150mm power module spacing. The extruded profile maintains flatness within 0.08mm/m after thermal cycling.With 1.279" (32.50mm) coverage, the solution provides uniform cooling for parallel-connected power devices. Infrared imaging shows less than 3 C variation across six parallel IGBTs.Precision-engineered 0.295" (7.50mm) optimizes performance in both natural and forced convection scenarios. The staggered fin arrangement reduces boundary layer thickness by 20%.The 6.00°C/W performance enables reliable operation during cooling fan failures. The design maintains critical components below 125 C in zero-airflow conditions for 45 minutes.Aluminum 6063-T6 alloy provides optimal balance between thermal conductivity (201 W/m K) and structural integrity. The material meets UL 94 V-0 flammability requirements.Gold Anodized surface treatment enhances corrosion resistance while improving radiative heat transfer by 12%. The finish withstands UV exposure per IEC 61215.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA, CPU, GPU
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Angled Fins
- Length: 1.279" (32.50mm)
- Width: 1.279" (32.50mm)
- Diameter: -
- Fin Height: 0.295" (7.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 6.00°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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