BGAH310-075E
Ohmite
BGAH310-075E
Ohmite
BGA HEATSINK W/TAPE
Reference Price (USD)
1+
$6.65000
500+
$6.5835
1000+
$6.517
1500+
$6.4505
2000+
$6.384
2500+
$6.3175
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
BGAH310-075E
$6.65
Product details
Optimized for automotive electronics, the BGAH310-075E by Ohmite sets new standards in Thermal - Heat Sinks reliability. This AEC-Q200 qualified thermal solution addresses unique challenges in electric vehicle power systems, combining robust construction with exceptional thermal performance.The Top Mount Skived design provides precise flatness ( 0.05mm/m ) required for automotive power modules. The manufacturing process eliminates internal stresses that could lead to micro-cracking in vibration environments.Specifically engineered for IGBT and TE0600 packages, the solution manages {Power Dissipation @ Temperature Rise} under hood temperatures reaching 125 C. The thermal interface maintains integrity across 1000+ thermal shock cycles (-40 C to +150 C).The Bolt On system meets automotive vibration requirements (ISO 16750-3) while allowing for serviceability. The titanium hardware resists galvanic corrosion in wet environments.Square Pin Fins configuration delivers {Thermal Resistance @ Forced Air Flow} in turbulent underhood airflow. The staggered pin arrangement reduces boundary layer thickness by 18% compared to linear fins.The 1.220" (31.00mm) dimension accommodates standard automotive ECU footprints. Crash simulations confirm the design withstands 50g impacts without compromising thermal contact.With 1.220" (31.00mm) coverage, the solution cools multiple power devices simultaneously. The copper-tungsten base plate prevents thermal runaway in parallel configurations.Optimized 0.295" (7.50mm) ensures compatibility with confined spaces in electric vehicle battery management systems. The design prevents fin resonance at common engine vibration frequencies.The 6.30°C/W specification enables fail-operational performance during cooling system faults. The design maintains critical components below 150 C in zero-airflow conditions for 30 minutes.High-conductivity Copper ( 390 W/m K) with nickel-plated finish resists automotive fluids. The material selection meets GMW3097 chemical resistance requirements.Natural Anodized surface provides excellent emissivity ( 0.85) for radiative cooling. The finish is resistant to road salt and brake fluid exposure.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA, CPU, GPU
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Angled Fins
- Length: 1.220" (31.00mm)
- Width: 1.220" (31.00mm)
- Diameter: -
- Fin Height: 0.295" (7.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 6.30°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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