BDN12-3CB/A01
CTS Thermal Management Products
BDN12-3CB/A01
CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.21"SQ
Reference Price (USD)
1+
$2.07979
500+
$2.0589921
1000+
$2.0381942
1500+
$2.0173963
2000+
$1.9965984
2500+
$1.9758005
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
BDN12-3CB/A01
$2.08
Product details
CTS Thermal Management Products's BDN12-3CB/A01 offers military-grade thermal solutions in the Thermal - Heat Sinks segment, specifically developed for aerospace and defense applications. This ruggedized design exceeds stringent military specifications while delivering exceptional thermal performance in extreme environments.The Board Level Vertical Extrusion configuration withstands 15g vibration per MIL-STD-810H. Unlike commercial designs, this variant maintains thermal contact under combined thermal and mechanical stress.Engineered for power modules in radar and avionics systems, the solution manages {Power Dissipation @ Temperature Rise} at 50,000ft altitude. The thermal interface maintains performance across -55 C to +125 C operational range.The Solderable Feet attachment meets IPC-CC-830 requirements for high-reliability soldering. The design survives 1000+ thermal cycles from -55 C to +125 C without joint degradation.Angled Fins configuration delivers {Thermal Resistance @ Forced Air Flow} in reverse airflow conditions common in aircraft. The aerodynamic profile reduces pressure drop by 18% compared to straight fins.The 1.210" (30.73mm) dimension complies with ARINC 600 rack standards for avionics. The design includes provisions for conductive cooling to cold plates in liquid-cooled systems.With 1.210" (30.73mm) coverage, the solution meets SWaP-C constraints in military electronics. The lightweight construction reduces overall system weight by up to 30% compared to traditional designs.Optimized 0.355" (9.02mm) ensures performance in thin-atmosphere conditions. The fin geometry is validated through computational fluid dynamics at 0.2atm pressure.The 6.80°C/W @ 400 LFM is qualified under MIL-STD-810G sand/dust conditions. The design prevents performance degradation despite particulate exposure.The 19.60°C/W specification enables operation during cooling system failures. The design maintains critical components below 100 C in zero-airflow conditions for 60 minutes.AavSHIELD 3C coated Aluminum provides EMI/RFI shielding exceeding MIL-STD-461G requirements. The material maintains thermal performance after salt fog exposure per MIL-STD-810G.Tin-plated finish ensures solderability after long-term storage per MIL-STD-2073-1. The surface treatment provides corrosion protection in naval environments.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Pin Fins
- Length: 1.210" (30.73mm)
- Width: 1.210" (30.73mm)
- Diameter: -
- Fin Height: 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 400 LFM
- Thermal Resistance @ Natural: 19.60°C/W
- Material: Aluminum
- Material Finish: Black Anodized
You May Also Be Interested In
