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BDN11-3CB/A01

CTS Thermal Management Products
BDN11-3CB/A01 Preview
BDN11-3CB/A01
CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.11"SQ
Reference Price (USD)
1+
$3.10000
500+
$3.069
1000+
$3.038
1500+
$3.007
2000+
$2.976
2500+
$2.945
Exquisite packaging
Discount
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BDN11-3CB/A01

BDN11-3CB/A01

$3.10

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
  • Attachment Method: Thermal Tape, Adhesive (Included)
  • Shape: Square, Pin Fins
  • Length: 1.110" (28.19mm)
  • Width: 1.110" (28.19mm)
  • Diameter: -
  • Fin Height: 0.355" (9.02mm)
  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: 7.20°C/W @ 400 LFM
  • Thermal Resistance @ Natural: 20.90°C/W
  • Material: Aluminum
  • Material Finish: Black Anodized

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