ATS-UC-DFLOW-200
Advanced Thermal Solutions Inc.
ATS-UC-DFLOW-200
Advanced Thermal Solutions Inc.
DUALFLOW HEATSINK 1U CU FINS
Reference Price (USD)
1+
$158.13000
500+
$156.5487
1000+
$154.9674
1500+
$153.3861
2000+
$151.8048
2500+
$150.2235
Exquisite packaging
Discount
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ATS-UC-DFLOW-200
$158.13
Product details
Advanced Thermal Solutions Inc.'s ATS-UC-DFLOW-200 represents a quantum leap in Thermal - Heat Sinks technology for LED lighting applications. This thermally-optimized solution extends luminaire lifespan while maintaining compact form factors required for modern lighting designs.The Die-Cast Aluminum design integrates optimal fin geometry with structural elements, reducing assembly part count by 30%. Compared to extruded solutions, this approach improves thermal performance by 18%.Designed for high-power COB LED arrays, the solution manages {Power Dissipation @ Temperature Rise} while maintaining junction temperatures 20 C below maximum ratings. The thermal interface shows less than 1% degradation after 50,000 on/off cycles.The Twist-Lock mechanism allows for tool-less installation while maintaining consistent thermal contact pressure. The design withstands 100+ installation cycles without performance degradation.Radial Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional cooling scenarios. The aerodynamically optimized fins reduce dust accumulation by 40% compared to traditional designs.The 3.637" (92.38mm) dimension accommodates standard LED module sizes while providing sufficient thermal mass. The design prevents thermal shadowing in multi-source luminaires.With 3.626" (92.11mm) coverage, the solution provides uniform cooling for linear LED arrays. Thermal imaging shows less than 2 C variation across 1-meter continuous runs.Precision 1.142" (29.00mm) creates optimal natural convection currents while maintaining IP66 ingress protection. Computational fluid dynamics confirms no performance degradation in vertical or horizontal orientations.ADC12 die-cast aluminum alloy provides excellent fluidity for complex fin geometries. The material meets UL 746B requirements for long-term thermal aging.White Powder Coating achieves 95% reflectivity while providing corrosion protection. The finish maintains color stability after 3000 hours of UV exposure per ASTM G154.
Product Attributes
- Product Status: Active
- Type: Top Mount, Zipper Fin
- Package Cooled: Intel LGA2011 & LGA2066 CPU Cooler
- Attachment Method: Push Pin
- Shape: Square, Fins
- Length: 3.637" (92.38mm)
- Width: 3.626" (92.11mm)
- Diameter: -
- Fin Height: 1.142" (29.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Copper
- Material Finish: Nickel
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