ATS-HP-F8L75S85W-427
Advanced Thermal Solutions Inc.
ATS-HP-F8L75S85W-427
Advanced Thermal Solutions Inc.
FLAT HEATPIPE 85W 10.3X4.7X75MM
Reference Price (USD)
1+
$10.71000
500+
$10.6029
1000+
$10.4958
1500+
$10.3887
2000+
$10.2816
2500+
$10.1745
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
ATS-HP-F8L75S85W-427
$10.71
Product details
Advanced Thermal Solutions Inc.'s ATS-HP-F8L75S85W-427 redefines thermal solutions in the Thermal - Heat Pipes, Vapor Chambers category. Optimized for high-power applications, this component combines cutting-edge materials with innovative design for maximum heat dissipation.Designed as a Heat Pipe, this thermal solution leverages two-phase cooling to achieve thermal conductivities exceeding 60,000 W/m K. The vapor chamber variant includes micro-fin structures for enhanced heat transfer.Featuring Epoxy or Solder options, the system supports both permanent and removable installations. The clip-mounted version allows for quick component replacement.The Flat geometry is optimized for forced convection, improving thermal performance by 22% in high-airflow environments. The trapezoidal variant minimizes airflow obstruction.Rated for 105.8W @ 75mm thermal dissipation, the solution handles extreme heat loads in power electronics. The 180W model is perfect for overclocked systems.Utilizing Sintered capillary action, the wick structure ensures efficient fluid return in any orientation. The grooved design achieves 0.18mm effective pore size.Available in 2.953" (75.00mm) sizes, the modular design caters to diverse thermal management needs. The 500mm version is designed for large-scale industrial equipment.Precision-engineered to 0.406" (10.31mm) specifications, the contact surface maintains <0.006mm flatness. The 20.00mm variant is tailored for high-TDP processors.With a 0.185" (4.70mm) profile, the low-height design is suitable for space-constrained applications. The 3.50mm version is ideal for embedded systems.Stable across 30°C ~ 120°C extremes, the solution features robust sealing for harsh environments. The 200 C variant is qualified for automotive under-hood applications.Fabricated from Copper substrates, the construction offers a balance of thermal performance and weight. The aluminum variant provides 200 W/m K conductivity with 45% weight reduction.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Flat
- Power - Cooling: 105.8W @ 75mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 2.953" (75.00mm)
- Width: 0.406" (10.31mm)
- Height: 0.185" (4.70mm)
- Diameter: -
- Operating Temperature: 30°C ~ 120°C
- Features: -
- Material: Copper
- Platform: -
You May Also Be Interested In
