ATS-HP-F8L500S13W-453
Advanced Thermal Solutions Inc.
ATS-HP-F8L500S13W-453
Advanced Thermal Solutions Inc.
FLAT HEATPIPE 13W 9.6X6X500MM
Reference Price (USD)
1+
$24.80000
500+
$24.552
1000+
$24.304
1500+
$24.056
2000+
$23.808
2500+
$23.56
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
ATS-HP-F8L500S13W-453
$24.80
Product details
The ATS-HP-F8L500S13W-453 by Advanced Thermal Solutions Inc. sets new standards in Thermal - Heat Pipes, Vapor Chambers technology. Developed for high-reliability applications, this thermal solution integrates advanced phase-change materials with precision-engineered fluid dynamics for exceptional heat transfer efficiency.Operating as a Heat Pipe, the component leverages evaporative cooling physics to achieve thermal conductivities exceeding 50,000 W/m K. The vapor chamber option features nanoparticle-enhanced working fluid.Accommodating Epoxy or Solder installation protocols, the system supports both automated assembly and field maintenance. Bolt-on versions withstand 15G vibrational loads.The Flat profile is optimized for natural convection applications. Square variants demonstrate 22% better heat dissipation in vertical orientation.Rated for 16.6W @ 500mm thermal dissipation, the solution manages transient thermal loads in power electronics. The 91W model is ideal for AI accelerator cards.Employing Sintered fluid management architecture, the capillary system maintains continuous phase-change cycles. Hybrid wick designs combine sintering and grooving for anti-gravity performance.Manufactured in 19.685" (500.00mm) configurations, the scalable solution addresses thermal challenges from wearable devices to industrial motors. The 300mm version is UL94 V-0 certified.Precision-formed to 0.378" (9.60mm) dimensions, the contact surfaces achieve <5 m roughness for optimal thermal interface. The 11.05mm variant is medical-grade certified.With just 0.236" (6.00mm) vertical profile, the ultra-compact design enables integration in mobile devices. The 2.50mm version supports smartphone SoC cooling.Stable across 30°C ~ 120°C conditions, the hermetic sealing prevents performance drift. The -40 C variant is qualified for space-constrained applications.Constructed from Copper alloys, the housing offers excellent corrosion resistance. Copper versions feature oxidation-resistant plating for humid environments.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Flat
- Power - Cooling: 16.6W @ 500mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 19.685" (500.00mm)
- Width: 0.378" (9.60mm)
- Height: 0.236" (6.00mm)
- Diameter: -
- Operating Temperature: 30°C ~ 120°C
- Features: -
- Material: Copper
- Platform: -
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