ATS-HP-F6L250S17W-263
Advanced Thermal Solutions Inc.
ATS-HP-F6L250S17W-263
Advanced Thermal Solutions Inc.
FLAT HEATPIPE 17W 8.2X2.7X250MM
Reference Price (USD)
1+
$13.51000
500+
$13.3749
1000+
$13.2398
1500+
$13.1047
2000+
$12.9696
2500+
$12.8345
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
ATS-HP-F6L250S17W-263
$13.51
Product details
The ATS-HP-F6L250S17W-263 by Advanced Thermal Solutions Inc. is a breakthrough in Thermal - Heat Pipes, Vapor Chambers technology, designed for high-efficiency thermal management in next-generation electronics. Engineered with advanced microchannel architecture, it delivers superior heat dissipation for demanding applications.Functioning as a Heat Pipe, this component utilizes phase-change cooling technology to achieve thermal conductivities up to 75,000 W/m K. The heat pipe variant features a composite wick structure for enhanced performance.Supporting Epoxy or Solder techniques, the system ensures secure mounting in high-vibration environments. The screw-mounted version withstands up to 20G shock loads.The Flat design is optimized for laminar airflow, reducing thermal resistance by 18% compared to standard profiles. The hexagonal variant is ideal for compact electronic assemblies.Capable of handling 21.6W @ 250mm thermal loads, the solution efficiently dissipates heat in high-performance computing systems. The 125W model is ideal for server CPUs.Incorporating Sintered technology, the capillary system ensures efficient fluid return even in adverse orientations. The sintered copper variant offers 0.20mm effective pore size.Available in 9.843" (250.00mm) configurations, the scalable design supports applications from handheld devices to industrial machinery. The 400mm version is tested for aerospace environments.Precision-machined to 0.322" (8.19mm) tolerances, the contact surface achieves <0.008mm flatness for optimal thermal interface. The 15.75mm variant is designed for high-power GPUs.With a slim 0.106" (2.70mm) profile, the component fits into ultra-thin devices without compromising cooling performance. The 2.80mm version is perfect for tablet cooling solutions.Reliable across 30°C ~ 120°C ranges, the hermetic sealing ensures long-term performance. The -65 C variant is qualified for military applications.Constructed from Copper alloys, the housing provides excellent thermal conductivity and corrosion resistance. The copper variant features a nickel-plated surface for added durability.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Flat
- Power - Cooling: 21.6W @ 250mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 9.843" (250.00mm)
- Width: 0.322" (8.19mm)
- Height: 0.106" (2.70mm)
- Diameter: -
- Operating Temperature: 30°C ~ 120°C
- Features: -
- Material: Copper
- Platform: -
You May Also Be Interested In
