ATS-EXL76-300-R1
Advanced Thermal Solutions Inc.
ATS-EXL76-300-R1
Advanced Thermal Solutions Inc.
HEATSINK AL6063 300X93.4X40MM
Reference Price (USD)
1+
$80.04000
500+
$79.2396
1000+
$78.4392
1500+
$77.6388
2000+
$76.8384
2500+
$76.038
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
ATS-EXL76-300-R1
$80.04
Product details
Advanced Thermal Solutions Inc.'s ATS-EXL76-300-R1 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 11.811" (300.00mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 3.677" (93.40mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 1.575" (40.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 0.50°C/W @ 200 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.The 5.20°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.
Product Attributes
- Product Status: Active
- Type: Top Mount, Extrusion
- Package Cooled: -
- Attachment Method: Adhesive
- Shape: Rectangular, Fins
- Length: 11.811" (300.00mm)
- Width: 3.677" (93.40mm)
- Diameter: -
- Fin Height: 1.575" (40.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 0.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 5.20°C/W
- Material: Aluminum
- Material Finish: Degreased
You May Also Be Interested In
