ATS-61700K-C2-R0
Advanced Thermal Solutions Inc.
ATS-61700K-C2-R0
Advanced Thermal Solutions Inc.
FANSINK ASSEMBLY W/ MOUNTING HAR
Reference Price (USD)
1+
$26.21000
500+
$25.9479
1000+
$25.6858
1500+
$25.4237
2000+
$25.1616
2500+
$24.8995
Exquisite packaging
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ATS-61700K-C2-R0
$26.21
Product details
The ATS-61700K-C2-R0 from Advanced Thermal Solutions Inc. delivers precision thermal management for medical devices in the Thermal - Heat Sinks category. Designed for reliability in life-critical applications, this solution combines biocompatible materials with exceptional thermal performance for imaging and diagnostic equipment.The Board Level Extrusion design provides EMI shielding compatibility crucial for sensitive medical electronics. The integrated grounding features reduce RF interference by 25dB compared to standard designs.Specialized for CPU and ASIC cooling in medical imaging systems, the solution handles {Power Dissipation @ Temperature Rise} with minimal acoustic signature. The thermal interface maintains stability through repeated sterilization cycles.Medical-grade Thermal Tape allows non-conductive attachment meeting IEC 60601-1 leakage current requirements. The adhesive maintains bond strength after 100+ autoclave cycles at 134 C.Rectangular Fins configuration achieves {Thermal Resistance @ Forced Air Flow} in laminar airflow environments. The streamlined design prevents particulate accumulation per ISO 14644 Class 5 cleanroom standards.The 2.913" (74.00mm) dimension fits standard medical cart footprints while providing sufficient thermal mass for pulsed power loads. The design minimizes eddy currents in MRI environments.With 2.913" (74.00mm) coverage, the solution cools multi-channel sensor arrays without thermal crosstalk. Infrared thermography shows less than 1 C variation across critical components.Precision 0.571" (14.50mm) ensures compatibility with medical device airflow restrictions (typically <0.5m/s). The fin density is optimized for silent operation (<20dB) in patient care environments.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Push Pin, Thermal Material
- Shape: Square, Pin Fins
- Length: 2.913" (74.00mm)
- Width: 2.913" (74.00mm)
- Diameter: -
- Fin Height: 0.571" (14.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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