AT97SC3205T-X3A1C-20
Microchip Technology
AT97SC3205T-X3A1C-20
Microchip Technology
FF COM I2C TPM 4.4MM TSSOP SEK
Reference Price (USD)
1+
$3.35000
500+
$3.3165
1000+
$3.283
1500+
$3.2495
2000+
$3.216
2500+
$3.1825
Exquisite packaging
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AT97SC3205T-X3A1C-20
$3.35
Product details
Microchip Technology's AT97SC3205T-X3A1C-20 reimagines Embedded - Microcontrollers - Application Specific for smart grid and power conversion applications. This application-specific microcontroller integrates advanced PWM generation with high-resolution ADC capabilities, enabling precise control of power electronics.Optimized for Trusted Platform Module (TPM) implementations, the device features hardware-based overcurrent protection with 50ns response time. The integrated sigma-delta modulators enable direct sensorless motor control.The AVR core includes dedicated trigonometric acceleration units. The parallel execution pipelines achieve 95% duty cycle accuracy at 100kHz switching frequencies.Supporting EEPROM options, the flash memory incorporates shadow registers for bumpless firmware updates. The dual-plane architecture allows live updates during continuous operation.With I²C connectivity, the device supports EtherCAT POWERLINK protocols. Each communication peripheral includes reinforced isolation meeting IEC 61800-5-1 standards.The 4 configurable ports feature 12-bit DAC outputs for analog control. Programmable dead-time insertion prevents shoot-through in bridge configurations.Operating from 3.3V inputs, the power architecture withstands 100V transients. The integrated gate drivers support SiC and GaN power devices.Certified for 0°C ~ 70°C operation, the package uses direct-bonded copper substrates. Thermal impedance is minimized for high-current applications.The Surface Mount option supports press-fit assembly for high-power PCBs. The package design accommodates thick copper layers for heat dissipation.Available in 28-TSSOP (0.173", 4.40mm Width) format, the package includes Kelvin sense connections. The low-inductance design minimizes switching losses at high di/dt rates.Supplied in 28-TSSOP configuration, each unit includes power cycling test reports. Production testing includes 100% burn-in at maximum junction temperature.
Product Attributes
- Product Status: Active
- Applications: Trusted Platform Module (TPM)
- Core Processor: AVR
- Program Memory Type: EEPROM
- Controller Series: -
- RAM Size: -
- Interface: I²C
- Number of I/O: 4
- Voltage - Supply: 3.3V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 28-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 28-TSSOP
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