ARJ11F-MBSC-L2
Abracon LLC
ARJ11F-MBSC-L2
Abracon LLC
CONN JACK 1PORT 1000 BASE-T PCB
Reference Price (USD)
1+
$6.26200
500+
$6.19938
1000+
$6.13676
1500+
$6.07414
2000+
$6.01152
2500+
$5.9489
Exquisite packaging
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ARJ11F-MBSC-L2
$6.26
Product details
Abracon LLC's ARJ11F-MBSC-L2 delivers cutting-edge Modular Connectors - Jacks With Magnetics technology for high-density data center applications, optimized for 400G Ethernet switch backplanes. This precision-engineered solution incorporates next-generation magnetics for superior return loss characteristics, enabling error-free transmission in hyperscale networking equipment. The innovative design reduces power consumption by 25% compared to previous generations while supporting advanced thermal management protocols.The RJ45 interface configuration supports 56G PAM-4 signaling with <0.5dB insertion loss per port at 14GHz, critical for 400G CR8 implementations.Available in 1-port high-density arrays, this solution enables 1U switches with 32x400G capacity while maintaining optimal airflow characteristics.The 1 row architecture minimizes stub lengths to <0.5mm, preserving signal integrity for 112G SerDes channels in next-gen switches.Designed for 10/100/1000 Base-T, AutoMDIX data center deployments, this connector exceeds IEEE 802.3bs specifications for insertion loss and far-end crosstalk.The Through Hole attachment system provides 0.2mm precision alignment for orthogonal direct-attach cable assemblies in top-of-rack switches.90° Angle (Right) PCB orientation enables optimal thermal convection cooling, reducing junction temperatures by 15 C in 40 C ambient environments.Employing Solder technology, the contact system achieves <35ps skew across all pairs while withstanding 1000+ insertion cycles.The 0.531" (13.49mm) profile accommodates 6mm heat sink clearance while maintaining impedance tolerance of 5 in 85 differential pairs.Does Not Contain LED status indicators support I2C-programmable brightness for datacenter lighting synchronization and power management.The 12-core architecture enables breakout configurations for 400G to 4x100G lane distribution without signal degradation.Shielded, EMI Finger effectiveness exceeds 70dB at 25GHz, critical for preventing EMI in multi-rack installations with 100+ transceivers.The Board Lock design includes integrated ESD protection diodes (8kV contact discharge) and thermal sensors for intelligent power management.Up release mechanism allows tool-less serviceability in high-density racks while preventing accidental disconnection.The Gold surface treatment maintains <10m contact resistance after 5000 mating cycles in 85%RH environments.Rated for 0°C ~ 70°C operation, this connector supports continuous 25W PoE++ power delivery without derating.
Product Attributes
- Product Status: Active
- Connector Type: RJ45
- Number of Ports: 1
- Number of Rows: 1
- Applications: 10/100/1000 Base-T, AutoMDIX
- Mounting Type: Through Hole
- Orientation: 90° Angle (Right)
- Termination: Solder
- Height Above Board: 0.531" (13.49mm)
- LED Color: Does Not Contain LED
- Number of Cores per Jack: 12
- Shielding: Shielded, EMI Finger
- Features: Board Lock
- Tab Direction: Up
- Contact Material: -
- Contact Finish: Gold
- Operating Temperature: 0°C ~ 70°C
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