APF30-30-13CB
CTS Thermal Management Products
APF30-30-13CB
CTS Thermal Management Products
HEATSINK LOW-PROFILE FORGED
Reference Price (USD)
1+
$5.79000
500+
$5.7321
1000+
$5.6742
1500+
$5.6163
2000+
$5.5584
2500+
$5.5005
Exquisite packaging
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APF30-30-13CB
$5.79
Product details
CTS Thermal Management Products's APF30-30-13CB represents a quantum leap in Thermal - Heat Sinks technology for LED lighting applications. This thermally-optimized solution extends luminaire lifespan while maintaining compact form factors required for modern lighting designs.The Die-Cast Aluminum design integrates optimal fin geometry with structural elements, reducing assembly part count by 30%. Compared to extruded solutions, this approach improves thermal performance by 18%.Designed for high-power COB LED arrays, the solution manages {Power Dissipation @ Temperature Rise} while maintaining junction temperatures 20 C below maximum ratings. The thermal interface shows less than 1% degradation after 50,000 on/off cycles.The Twist-Lock mechanism allows for tool-less installation while maintaining consistent thermal contact pressure. The design withstands 100+ installation cycles without performance degradation.Radial Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional cooling scenarios. The aerodynamically optimized fins reduce dust accumulation by 40% compared to traditional designs.The 1.181" (30.00mm) dimension accommodates standard LED module sizes while providing sufficient thermal mass. The design prevents thermal shadowing in multi-source luminaires.With 1.181" (30.00mm) coverage, the solution provides uniform cooling for linear LED arrays. Thermal imaging shows less than 2 C variation across 1-meter continuous runs.Precision 0.500" (12.70mm) creates optimal natural convection currents while maintaining IP66 ingress protection. Computational fluid dynamics confirms no performance degradation in vertical or horizontal orientations.The 2.50°C/W @ 200 LFM performance remains stable in enclosed luminaires with limited airflow. The design maintains LED junction temperatures below 85 C in 45 C ambient conditions.ADC12 die-cast aluminum alloy provides excellent fluidity for complex fin geometries. The material meets UL 746B requirements for long-term thermal aging.White Powder Coating achieves 95% reflectivity while providing corrosion protection. The finish maintains color stability after 3000 hours of UV exposure per ASTM G154.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Not Included)
- Shape: Square, Fins
- Length: 1.181" (30.00mm)
- Width: 1.181" (30.00mm)
- Diameter: -
- Fin Height: 0.500" (12.70mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: Black Anodized
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