APF19-19-10CB/A01
CTS Thermal Management Products
APF19-19-10CB/A01
CTS Thermal Management Products
HEATSINK FORGED W/ADHESIVE TAPE
Reference Price (USD)
1+
$5.61000
500+
$5.5539
1000+
$5.4978
1500+
$5.4417
2000+
$5.3856
2500+
$5.3295
Exquisite packaging
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APF19-19-10CB/A01
$5.61
Product details
The APF19-19-10CB/A01 by CTS Thermal Management Products revolutionizes thermal management in the Thermal - Heat Sinks sector, specifically tailored for renewable energy inverters. This advanced solution combines superior heat dissipation with rugged environmental protection, ensuring reliable performance in solar and wind power applications.The Top Mount Extruded design features optimized fin geometry that reduces thermal resistance by 22% compared to standard profiles. When subjected to IEC 60068-2-52 salt spray testing, the corrosion resistance exceeds 1000 hours.Designed for high-power IGBT modules, this solution handles {Power Dissipation @ Temperature Rise} in 85 C ambient conditions. The thermal interface maintains stability across 20,000+ power cycles, critical for solar farm operations.The Spring Clip system provides consistent mounting pressure (15-25N) across all PCB thicknesses (1.0-3.2mm). Field testing demonstrates vibration resistance up to 5g RMS in wind turbine applications.Hexagonal Pin Fin configuration achieves {Thermal Resistance @ Forced Air Flow} in multidirectional airflow environments. Computational analysis shows 15% better turbulence management than traditional square pin designs.The 0.748" (19.00mm) dimension accommodates standard 150mm power module spacing. The extruded profile maintains flatness within 0.08mm/m after thermal cycling.With 0.748" (19.00mm) coverage, the solution provides uniform cooling for parallel-connected power devices. Infrared imaging shows less than 3 C variation across six parallel IGBTs.Precision-engineered 0.370" (9.40mm) optimizes performance in both natural and forced convection scenarios. The staggered fin arrangement reduces boundary layer thickness by 20%.Validated under UL 1741 standards, the 5.30°C/W @ 200 LFM remains stable in 95% relative humidity conditions. The design prevents condensation-induced performance degradation.Aluminum 6063-T6 alloy provides optimal balance between thermal conductivity (201 W/m K) and structural integrity. The material meets UL 94 V-0 flammability requirements.Gold Anodized surface treatment enhances corrosion resistance while improving radiative heat transfer by 12%. The finish withstands UV exposure per IEC 61215.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Fins
- Length: 0.748" (19.00mm)
- Width: 0.748" (19.00mm)
- Diameter: -
- Fin Height: 0.370" (9.40mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: Black Anodized
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