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APF19-19-06CB

CTS Thermal Management Products
APF19-19-06CB Preview
APF19-19-06CB
CTS Thermal Management Products
HEATSINK LOW-PROFILE FORGED
Reference Price (USD)
1+
$4.55000
500+
$4.5045
1000+
$4.459
1500+
$4.4135
2000+
$4.368
2500+
$4.3225
Exquisite packaging
Discount
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APF19-19-06CB

APF19-19-06CB

$4.55

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
  • Attachment Method: Thermal Tape, Adhesive (Not Included)
  • Shape: Square, Fins
  • Length: 0.748" (19.00mm)
  • Width: 0.748" (19.00mm)
  • Diameter: -
  • Fin Height: 0.250" (6.35mm)
  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: 7.10°C/W @ 200 LFM
  • Thermal Resistance @ Natural: -
  • Material: Aluminum
  • Material Finish: Black Anodized

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