AM5729BABCXA
Texas Instruments
AM5729BABCXA
Texas Instruments
VAYU PG 2.0
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$83.40267
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$82.5686433
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$81.7346166
1500+
$80.9005899
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$80.0665632
2500+
$79.2325365
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AM5729BABCXA
$83.40
Product details
The AM5729BABCXA by Texas Instruments establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A15 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.5GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The DSP, BB2D, IPU, IVA, GPU, VPE neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR3, SRAM memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.GbE (2) connectivity enables distributed AI processing across edge nodes with precise time synchronization.SATA 3Gbps (1) interfaces provide high-speed storage for AI model repositories and inference datasets.The USB 2.0 (1), USB 3.0 (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.8V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 105°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.The 760-BFBGA, FCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 760-FCBGA (23x23), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A15
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: DSP, BB2D, IPU, IVA, GPU, VPE
- RAM Controllers: DDR3, SRAM
- Graphics Acceleration: Yes
- Display & Interface Controllers: -
- Ethernet: GbE (2)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 (1), USB 3.0 (1)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: -
- Package / Case: 760-BFBGA, FCBGA
- Supplier Device Package: 760-FCBGA (23x23)
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