AHDP02-24-23PR-BRA

Amphenol Sine Systems Corp

General info

Part Number

AHDP02-24-23PR-BRA

Manufacturer

Amphenol Sine Systems Corp

Description:

23 POSITION PANEL MOUNT RECEPTAC

Reference Price (USD)

$13.95000

500+

$13.8105

1000+

$13.671

1500+

$13.5315

2000+

$13.392

2500+

$13.2525

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

AHDP02-24-23PR-BRA

$13.95

Product details

The AHDP02-24-23PR-BRA by Amphenol Sine Systems Corp delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Receptacle Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Male Pins implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 23 configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Compatible with 24-23 inserts, allowing customized signal routing. The thermally isolated insert prevents heat transfer between stages.Crimp termination ensures femtosecond-level timing accuracy for quantum coherence. The superconducting contacts maintain <0.01 phase stability.Designed for 16 contacts, the current capacity reaches 100A in superconducting state. The optimized geometry minimizes eddy current losses.The Panel Mount installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.The Flange design enables hermetic sealing to 10^-11 atm-cc/s leak rate. The indium-sealed interface withstands 1000 thermal cycles from 300K to 4K.Bayonet Lock mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring Keyed polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.Using Plastic formulation, the connector exhibits negligible thermal emf (<0.1 V/K). The material's thermal conductivity is tailored for cryogenic heat sinking.The Thermoplastic construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.The Black coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Rated IP67/IP69K - Dust Tight, Water Resistant, Waterproof, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Integrated Backshell include superconducting contacts for zero-resistance signal paths. The niobium-titanium alloy contacts transition below 9.3K critical temperature.Unshielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.