AF500-707005

CUI Devices

General info

Part Number

AF500-707005

Manufacturer

CUI Devices

Description:

THERM PAD 70MMX70MM 1 SHEET=15PC

Reference Price (USD)

$42.24000

500+

$41.8176

1000+

$41.3952

1500+

$40.9728

2000+

$40.5504

2500+

$40.128

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

AF500-707005

$42.24

Product details

The AF500-707005 from CUI Devices represents a significant advancement in Thermal - Pads, Sheets for industrial automation systems. This robust thermal solution is specifically designed to meet the demanding requirements of factory automation equipment and industrial control systems.As a high-reliability Pad, Sheet, this product offers exceptional long-term stability under continuous operation. The material maintains its thermal properties even after extended exposure to industrial operating conditions.Precision-engineered in Square formats, this solution enables efficient thermal management of industrial power electronics. The optimized geometries ensure maximum contact area with heat-generating components.Available in 70.00mm x 70.00mm sizes, this material accommodates both large motor drives and compact control modules. The standardized dimensions ensure compatibility with common industrial enclosure designs.The carefully controlled 0.0197" (0.500mm) provides optimal balance between thermal transfer and mechanical compliance. This characteristic is particularly valuable in applications subject to mechanical vibration.Formulated with industrial-grade Non-Silicone, this pad exhibits exceptional resistance to oils and chemicals. This property ensures reliable performance in harsh manufacturing environments.Featuring Tacky - Both Sides properties, this solution offers secure component bonding in vibrating environments. The high-tack formulation maintains adhesion integrity throughout the product lifecycle.The White identification system enables quick visual verification during maintenance procedures. This feature simplifies component replacement in complex industrial systems.Achieving 3.0W/m-K performance, this solution enables more efficient cooling of industrial power electronics. The material's consistent performance helps extend component lifespan in demanding applications.