AF500-202005

CUI Devices

General info

Part Number

AF500-202005

Manufacturer

CUI Devices

Description:

THERM PAD 20MMX20MM 1 SHT=190PC

Reference Price (USD)

$43.71000

500+

$43.2729

1000+

$42.8358

1500+

$42.3987

2000+

$41.9616

2500+

$41.5245

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

AF500-202005

$43.71

Product details

CUI Devices's AF500-202005 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.As a cryogenic Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Fabricated in precision Square configurations, this material accommodates complex qubit array geometries. The nanoscale-edge finishing ensures perfect interface contact without damaging delicate quantum components.With 20.00mm x 20.00mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.0197" (0.500mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Constructed from quantum-grade Non-Silicone, this pad exhibits exceptional purity (99.9999%). The defect-free crystalline structure minimizes thermal phonon scattering at cryogenic temperatures.Featuring Tacky - Both Sides properties, this solution offers cryogenic-compatible bonding. The specialized formulation maintains adhesion integrity across extreme temperature ranges without outgassing.The White identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.Achieving 3.0W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.