AF200-101005

The AF200-101005 from CUI Devices represents a breakthrough in Thermal - Pads, Sheets technology, engineered for high-performance thermal management solutions. This advanced thermal interface material delivers exceptional heat dissipation capabilities while maintaining electrical insulation properties. With its innovative composition and precision engineering, this product sets new standards for reliability in demanding applications.As a premium Pad, Sheet, this product combines superior thermal conductivity with mechanical flexibility. Unlike standard interface materials, it maintains consistent performance under varying pressure conditions, making it particularly effective for uneven surface applications.Available in Square configurations, this thermal pad accommodates diverse component geometries. The precision-cut edges ensure optimal coverage while minimizing material waste during installation.With standard dimensions of 10.00mm x 10.00mm, this solution fits most common electronic enclosures. The size-optimized design allows for efficient thermal pathway creation without compromising space constraints in compact assemblies.Featuring a precise 0.0197" (0.500mm) profile, this material achieves optimal balance between thermal transfer and mechanical compliance. Thinner variants provide minimal interface resistance, while thicker options offer superior gap-filling capabilities.Constructed from high-grade Non-Silicone, this pad exhibits exceptional thermal stability across wide temperature ranges. The advanced composite formulation resists degradation while maintaining consistent thermal performance throughout its service life.Featuring Tacky - Both Sides properties, this solution offers secure component bonding without compromising reworkability. The pressure-sensitive formulation ensures reliable attachment while allowing for clean removal when required.The distinctive White appearance facilitates easy visual inspection during quality control processes. This color-coding system aids in quick identification within complex BOM structures.Delivering outstanding 2.0W/m-K performance, this material outperforms traditional thermal interfaces by up to 40%. Its anisotropic properties enable directional heat flow for targeted cooling solutions.