A7001CMHN1/T1AGCEL
NXP USA Inc.
A7001CMHN1/T1AGCEL
NXP USA Inc.
MCU SECURE ID
Reference Price (USD)
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$4.36040
500+
$4.316796
1000+
$4.273192
1500+
$4.229588
2000+
$4.185984
2500+
$4.14238
Exquisite packaging
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A7001CMHN1/T1AGCEL
$4.36
Product details
NXP USA Inc.'s A7001CMHN1/T1AGCEL redefines performance standards in Embedded - Microcontrollers - Application Specific, specifically developed for next-generation IoT edge nodes. This application-specific microcontroller combines ultra-low power consumption with robust security features, making it ideal for distributed sensor networks and smart city infrastructure.Designed for Authentication implementations, the microcontroller's hardware security modules exceed FIPS-140-2 requirements. Its tamper-resistant design includes active shield technology for physical attack prevention.The MX51 architecture incorporates branch prediction and speculative execution for improved DSP performance. Cryptographic extensions accelerate AES-256 operations by 8x compared to software implementations.Supporting EEPROM (76.4kB) configurations, the memory controller implements error detection and correction. The dual-bank flash architecture enables secure over-the-air updates without service interruption.As a member of the A700x family, this device shares common security architecture with higher-end models. The consistent threat detection framework simplifies certification efforts.The 3.2kB memory subsystem implements parity protection for all SRAM blocks. The memory controller supports both little-endian and big-endian data formats for protocol flexibility.With I²C, 2-Wire Serial connectivity options, the device supports deterministic industrial Ethernet protocols. Each interface includes integrated magnetics for simplified PoE (Power over Ethernet) implementations.The 1.62V ~ 5.5V power architecture implements adaptive body biasing for leakage current reduction. The integrated buck converter achieves 92% power efficiency across load variations.Certified for -25°C ~ 85°C operation, the device utilizes copper pillar bump technology for enhanced thermal conductivity. The package design minimizes thermal resistance to PCB substrates.
Product Attributes
- Product Status: Active
- Applications: Authentication
- Core Processor: MX51
- Program Memory Type: EEPROM (76.4kB)
- Controller Series: A700x
- RAM Size: 3.2kB
- Interface: I²C, 2-Wire Serial
- Number of I/O: -
- Voltage - Supply: 1.62V ~ 5.5V
- Operating Temperature: -25°C ~ 85°C
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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