A3PE1500-FG676I

The A3PE1500-FG676I from Microchip Technology represents a cutting-edge solution in Embedded - FPGAs (Field Programmable Gate Array), engineered for high-performance signal processing applications. This FPGA delivers exceptional logic density and power efficiency, making it ideal for 5G infrastructure and advanced radar systems. With its robust architecture and flexible I/O configuration, designers can achieve unprecedented levels of system integration while maintaining signal integrity across demanding operating conditions.The embedded memory capacity of 276480 bits supports high-bandwidth data buffering requirements, particularly beneficial for real-time video processing applications. Engineered with error correction capabilities, this memory architecture ensures reliable operation in mission-critical systems.With 444 configurable I/O ports, the device offers exceptional interface flexibility for mixed-signal environments. The I/O banks are optimized for simultaneous switching noise reduction, crucial for maintaining signal fidelity in high-speed communication protocols.With 1500000 equivalent gate count, this FPGA delivers the necessary computational resources for complex state machine implementations. The balanced ratio of combinational to sequential logic elements facilitates efficient pipeline design.Operating within 1.425V ~ 1.575V voltage range, this FPGA achieves superior power efficiency without compromising computational throughput. The adaptive voltage scaling feature dynamically adjusts power consumption based on workload demands.Designed for Surface Mount installation, the package ensures reliable mechanical and electrical connections in space-constrained applications. The mounting solution has been validated for vibration resistance in automotive electronics environments.Rated for -40°C ~ 100°C (TJ) operation, this component maintains stable clock distribution networks even under extreme thermal conditions. The temperature-compensated circuitry prevents timing skew in precision measurement systems.The 676-BGA package format provides optimal thermal dissipation for high-density logic implementations. Compared to conventional packaging, this solution reduces parasitic inductance for improved signal propagation characteristics.Available in 676-FBGA (27x27) configuration, the device supports standardized PCB layout practices while offering enhanced EMI shielding. The package geometry has been optimized for wave soldering compatibility in high-volume production.