A2F200M3F-FGG484
Microchip Technology
A2F200M3F-FGG484
Microchip Technology
IC SOC CORTEX-M3 80MHZ 484FBGA
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Product details
Microchip Technology's A2F200M3F-FGG484 redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making A2F200M3F-FGG484 the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MCU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The ARM® Cortex®-M3 core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.256KB of low-latency flash memory stores extensive effect presets and configuration profiles.With 64KB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DMA, POR, WDT include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The EBI/EMI, Ethernet, I²C, SPI, UART/USART suite supports all major audio networking protocols while maintaining strict jitter performance.Operating at 80MHz, the processor meets the real-time requirements of high-channel-count audio systems.ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for 0°C ~ 85°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 484-BGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 484-FPBGA (23x23), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 256KB
- RAM Size: 64KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
- Speed: 80MHz
- Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
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