A2F060M3E-1FG256M
Microsemi Corporation
A2F060M3E-1FG256M
Microsemi Corporation
IC SOC CORTEX-M3 100MHZ 256FBGA
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
A2F060M3E-1FG256M
$0.00
Product details
Microsemi Corporation's A2F060M3E-1FG256M revolutionizes Embedded - System On Chip (SoC) technology for aerospace and defense applications. Optimized for extreme environments, this radiation-hardened SoC combines fault-tolerant design with military-grade reliability, making A2F060M3E-1FG256M the preferred choice for satellite systems where component longevity and single-event upset immunity are critical.The triple-redundant MCU, FPGA architecture provides SEU mitigation through continuous voting logic, ensuring uninterrupted operation in high-radiation orbits.The ARM® Cortex®-M3 core delivers space-qualified processing power with built-in error detection and correction mechanisms for mission-critical computations.128KB of radiation-tolerant flash memory provides secure storage for flight software with single-bit error correction capabilities.With 16KB of scrubbed RAM, the processor maintains data integrity even during solar flare events and other space radiation phenomena.Space-grade DMA, POR, WDT include MIL-STD-1553 interfaces and spacewire controllers essential for spacecraft avionics systems.The EBI/EMI, I²C, SPI, UART/USART suite supports both traditional aerospace databuses and modern high-speed interconnects required for next-generation satellite payloads.Operating at 100MHz, the processor meets the real-time requirements of attitude control systems while staying within strict power budgets.ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops include latch-up immune circuitry and total dose radiation hardening to 100krad(Si) for long-duration missions.Qualified for -55°C ~ 125°C (TJ), the component maintains stable operation from cryogenic space environments to sun-facing satellite surfaces.The 256-LBGA package features hermetic sealing and gold-plated contacts for reliability in vacuum conditions.Available in 256-FPBGA (17x17), the device meets MIL-PRF-38535 Class K requirements for space applications.
Product Attributes
- Product Status: Obsolete
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 128KB
- RAM Size: 16KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, I²C, SPI, UART/USART
- Speed: 100MHz
- Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
- Operating Temperature: -55°C ~ 125°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FPBGA (17x17)
You May Also Be Interested In
