A18444-19
Laird Technologies - Thermal Materials
A18444-19
Laird Technologies - Thermal Materials
TFLEX HD7.5,4.75 9X9IN,
Reference Price (USD)
1+
$317.31500
500+
$314.14185
1000+
$310.9687
1500+
$307.79555
2000+
$304.6224
2500+
$301.44925
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
A18444-19
$317.32
Product details
The A18444-19 from Laird Technologies - Thermal Materials represents a breakthrough in Thermal - Pads, Sheets technology, engineered for high-performance thermal management solutions. This advanced thermal interface material delivers exceptional heat dissipation capabilities while maintaining electrical insulation properties. With its innovative composition and precision engineering, this product sets new standards for reliability in demanding applications.As a premium Gap Filler Pad, Sheet, this product combines superior thermal conductivity with mechanical flexibility. Unlike standard interface materials, it maintains consistent performance under varying pressure conditions, making it particularly effective for uneven surface applications.Available in Square configurations, this thermal pad accommodates diverse component geometries. The precision-cut edges ensure optimal coverage while minimizing material waste during installation.With standard dimensions of 228.60mm x 228.60mm, this solution fits most common electronic enclosures. The size-optimized design allows for efficient thermal pathway creation without compromising space constraints in compact assemblies.Constructed from high-grade Silicone, Ceramic Filled, this pad exhibits exceptional thermal stability across wide temperature ranges. The advanced composite formulation resists degradation while maintaining consistent thermal performance throughout its service life.The distinctive Gray appearance facilitates easy visual inspection during quality control processes. This color-coding system aids in quick identification within complex BOM structures.Delivering outstanding 7.5W/m-K performance, this material outperforms traditional thermal interfaces by up to 40%. Its anisotropic properties enable directional heat flow for targeted cooling solutions.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 228.60mm x 228.60mm
- Thickness: -
- Material: Silicone, Ceramic Filled
- Adhesive: -
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 7.5W/m-K
You May Also Be Interested In