A18213-02
Laird Technologies - Thermal Materials
A18213-02
Laird Technologies - Thermal Materials
TFLEX SF10,0.50 229X229MM
Reference Price (USD)
1+
$76.71000
500+
$75.9429
1000+
$75.1758
1500+
$74.4087
2000+
$73.6416
2500+
$72.8745
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
A18213-02
$76.71
Product details
Laird Technologies - Thermal Materials's A18213-02 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Gap Filler Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Square configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 229.00mm x 229.00mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0197" (0.500mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Non-Silicone, Ceramic Filled formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.The Gray coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.Delivering 10W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 229.00mm x 229.00mm
- Thickness: 0.0197" (0.500mm)
- Material: Non-Silicone, Ceramic Filled
- Adhesive: -
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 10W/m-K
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