A17883-05

Laird Technologies - Thermal Materials

General info

Part Number

A17883-05

Manufacturer

Laird Technologies - Thermal Materials

Description:

TFLEX HD81250 9" X 9"

Reference Price (USD)

$101.30000

500+

$100.287

1000+

$99.274

1500+

$98.261

2000+

$97.248

2500+

$96.235

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

A17883-05

$101.30

Product details

The A17883-05 from Laird Technologies - Thermal Materials delivers military-grade Thermal - Pads, Sheets solutions for harsh environment electronics. This extreme-duty thermal interface material meets MIL-STD-810 requirements while providing reliable thermal management for defense and aerospace systems.As a MIL-spec Gap Filler Pad, Sheet, this product combines extreme temperature stability with vibration resistance. The specially formulated matrix withstands 50G mechanical shock while maintaining perfect thermal contact.Precision-manufactured in Square configurations, this material meets tight military tolerances. The laser-cut edges ensure perfect fitment in ruggedized enclosures with strict dimensional requirements.With 228.60mm x 228.60mm dimensions, this solution accommodates standard military electronic packaging. The size-optimized design allows for efficient thermal management in space-constrained armored vehicles and aircraft systems.Featuring ultra-tight 0.0500" (1.270mm) tolerances ( 0.01mm), this material ensures reliable interface contact under vibration. The controlled compression characteristics maintain optimal thermal transfer in dynamic environments.Formulated with mil-spec Silicone, Ceramic Filled, this pad exhibits exceptional resistance to fuels and hydraulic fluids. This property ensures long-term reliability in engine compartments and weapons systems.The Teal coding system complies with military identification standards. This standardized coloring facilitates quick material verification during field maintenance operations.Delivering 6.0W/m-K performance, this material enables effective cooling in armored electronics. The anisotropic properties provide directional heat flow for targeted cooling of high-power components.